| 圖片 | 型號(hào) | 品牌 | 封裝 | 數(shù)量 | 描述 | PDF資料 |
|---|---|---|---|---|---|---|
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ZSSC3026CI1D ES | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3026CI6C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3036CC1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3036CI1D ES | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3122AA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3122AI1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3122AI1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3123AA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3123AI1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BA1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BA1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BE1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3131BE1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3135BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3135BE1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3136BA1B | IDT, Integrated Device Technology Inc | - | WAFER (UNSAWN) - BOX | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3136BA1C | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - FRAME | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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ZSSC3136BA1D | IDT, Integrated Device Technology Inc | - | DICE (WAFER SAWN) - WAFFLE PACK | ||
| 參數(shù)：IDT, Integrated Device Technology Inc|托盤(pán)|*|在售|-|-|-|-|-|-|-|-|... | ||||||
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